SikaBiResin® CH 910-5 – Slow Epoxy Hardener

SikaBiResin® CH 910-5 – Slow Epoxy Hardener

$310.00
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SikaBiResin® CH 910-5 – Slow Epoxy Hardener

SikaBiResin® CH 910-5 – Slow Epoxy Hardener

$310.00

SikaBiResin® CH 910-5 – Slow Epoxy Infusion Hardener

SikaBiResin® CH 910-5 is a slow-reacting epoxy hardener developed for use with SikaBiResin® CR-910 epoxy resin in vacuum infusion and RTM composite manufacturing processes. It is specifically formulated to provide extended open time and controlled cure behavior for large, complex composite structures.

CH 910-5 is ideal for large parts, thick laminates, or long infusion cycles, where consistent flow, complete fiber wet-out, and predictable processing are critical. When combined with CR-910, the system delivers excellent laminate quality, high mechanical performance, and reliable processing across extended infusion times.

Once cured, the CR-910 / CH 910-5 system offers excellent mechanical strength, thermal stability, and chemical resistance, making it well suited for demanding structural composite applications requiring extended working time.


Key Features & Benefits

  • Slow reactivity for extended open and infusion times

  • Designed for use with SikaBiResin® CR-910 resin

  • Optimized for vacuum infusion and RTM processes

  • Excellent flow behavior and fiber wet-out

  • High mechanical strength and fatigue resistance

  • Ideal for large parts and thick laminate structures

  • Controlled and predictable cure behavior


Typical Applications

  • Large-scale vacuum infusion components

  • Thick laminate composite structures

  • Wind turbine blades and structural components

  • Marine and offshore composite parts

  • Industrial and transportation composites


Typical Technical Properties (refer to TDS for full details)

  • Product Type: Epoxy Hardener (Slow)

  • Compatible Resin: SikaBiResin® CR-910

  • Reactivity: Slow

  • Mix Ratio: [Placeholder – Resin : Hardener]

  • Pot Life: [Placeholder – minutes @ stated temperature]

  • Processing Methods: Vacuum Infusion, RTM

  • Cure Profile: [Placeholder – ambient / post-cure]

  • Replaces CH910-2

Technical Documentation

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